IEMECON 2025 presents three comprehensive technical tracks covering cutting-edge research in Intelligent Embedded Systems, Microelectronics, Communication Networks, and Photonics. Submit your original work in any of these specialized domains.
1
Intelligent Embedded & Machine Learning
- Adaptive learning algorithms for dynamic embedded systems
- Benchmarking and performance evaluation of embedded ML models
- Blockchain for securing IoT transactions
- Cloud & IoT Networks
- Cognitive IoT: Learning and adapting IoT devices
- Consumer Electronics (IoT)
- Deep learning applications for embedded systems
- Device to Device Communication
- Edge computing and distributed learning in embedded systems
- Edge-based data aggregation and compression techniques
- Efficient algorithms for embedded AI
- Explainable AI for embedded systems
- Federated learning on edge devices
- Hybrid Network
- Low-power communication protocols for sensor networks
- Machine Intelligence Systems & Technologies
- Mobile Computing
- Network Security
- Neural network optimization for resource-constrained devices
- Parallel Computing for Industrial IoT
- QoS Management in IoT Networks
- Real-time machine learning on edge devices
- Robotics and Autonomous IoT Modelling
- Security and privacy in embedded IoT networks
- Sensor fusion and data analytics in embedded systems
- Signal & Image Processing
- Smart Surveillance
- Speech Processing
- Transfer learning in resource-constrained environments
- Vehicular Networks
- Wireless sensor networks for smart environments
2
Microelectronics & VLSI
- Analog/Digital/Mixed Signal Circuits
- Artificial Intelligence in Electronics
- Artificial Intelligence Accelerator
- Beyond 2D in Packaging and interconnects
- Beyond-CMOS Nanoelectronics
- Biomedical, Photonics, and Quantum Electronics
- Chiplets based heterogeneous designs
- Device to Device Communication
- Design Automation & CAD Tools
- Design for Test
- Device Modelling and Process Simulation
- Electronic Design Automation (EDA)
- Emerging Technologies and Applications
- Hardware-Software Co-Design
- Lab on Chip
- Low Power Integrated Circuits & Devices
- Memory, Computing & Processor Design
- MEMS/NEMS/MOEMS Devices
- Multi-FPGA Systems
- Nano Electronic VLSI
- Nanoelectronics, Magnetic, Optoelectronics Materials and Devices
- Neuromorphic Engineering
- Power Electronics
- Quantum Computing & Devices
- Reconfigurable FPGA-based Design
- Sensory Circuits and Systems
- System Integration
- System on Chip
- Thin Film, Ultra High Speed Transistors, HEMT/HBT
- VLSI Design Optimization
- Yield Analysis and Optimization
3
Microwave, Photonics & Communication
- 3D-printed Microwave Antennas & Structures
- Aircraft & Satellite Antennas
- AI & ML in Photonics
- Bio-Photonics
- Cognitive Radio
- Fiber & Guided Wave Photonics
- Lasers & Nonlinear Optics
- Meta-Material & Meta-Surface
- Microwave & Terahertz Photonics
- Microwave Absorbers
- Microwave Holography
- Microwave in Medicals
- Millimeter-wave & THz Antennas
- MIMO & 5G
- Mobile Communication
- Nanophotonics, Plasmonics & Metamaterials
- Optical Communication and Networks
- Optical Microscopy and Imaging
- Photonic Materials & Devices
- Photonics
- Planar Antennas
- Plasmonics
- Quantum Information and Processing
- Quantum Photonics
- Radar & Remote Sensing Antennas
- Reconfigurable Antennas & Arrays
- Satellite & Space Communication
- Topological Photonics
- Ultra Wide Band Antennas
- Wearable Antennas
- Wireless Transceiver
Submission Guidelines
Authors are encouraged to submit original research papers addressing any of the topics listed in the three technical tracks. Papers should present novel contributions, experimental results, or theoretical advances in their respective domains. All submissions will be reviewed by the Technical Program Committee and evaluated based on originality, quality, and relevance to the conference.
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